Standard Test Methods for Pressure-Sensitive Adhesive-Coated Tapes Used for Electrical and Electronic Applications
Methods A and B are both related to adhesion strength to steel and backing. They are similar but test different aspects of the adhesion:
Method A: Adhesion Strength to Steel
Objective: To measure the adhesive peel strength of the tape when it is bonded to a standard steel test panel.
Procedure:
A strip of the pressure-sensitive adhesive tape is applied to a clean, flat stainless steel panel under controlled pressure and conditions.
After a specified dwell time (e.g., 20 minutes), the tape is peeled from the panel at a 180° angle at a uniform rate using a tensile testing machine.
The force required to peel the tape is measured and recorded.
Purpose: This test method is crucial for determining how well the tape will stick to common metallic substrates. It evaluates the “tack” and adhesive strength of the tape.
Method B: Adhesion Strength to Backing
Objective: To measure the adhesive peel strength of the tape when it is bonded to its own backing.
Procedure:
A strip of the tape is applied to a second strip of the same tape, which is already affixed to the steel test panel from Method A.
After a specified dwell time, the top tape is peeled from the bottom tape’s backing at a 180° angle at a uniform rate.
The force required to peel the tape is measured.
Purpose: This test is essential for applications where the tape is wrapped on itself (e.g., bundling wires or acting as a protective wrap). It evaluates the tape’s ability to adhere to its own non-adhesive side (the backing), which can be coated with a release liner.
